Low temperature sintering Cu nanoparticle (NP) paste is a promising solution to fulfill the harsh requirements of Wide band gap (WBG) power device packaging. However, spontaneous oxidation of the Cu ...

Drying of stencil-, screen-, or dispense-printed paste is a crucial, yet taken-for-granted, presintering step for sinterable-silver (SS) interconnect processing and ultimately its reliability. If the ...

Fraunhofer IFAM, Dresden, Germany, has released its programme for its Sinter-based Additive Manufacturing workshop, taking place from October 8-9, 2025, in Bremen, Germany. For the sixth time, this ...

Discover Mitsui Mining & Smelting's innovative bonding sheet patent, enhancing electrical connectivity in electronics with high-performance copper foil and sinterable films.

The patterning of silver nanowires (AgNWs) is subject to critical challenges, which have seriously limited their practical applications. This work describes a simple and efficient method combining ...

Emery Oleochemicals has supplied its binder system to the powder injection industry over thirty years. This binder system is said to be applicable to almost all sinterable materials to create entirely ...

Tethon 3D obtained a patent for a key 3D printing feature in the resin process. The Omaha-based company is known for their production of ceramic resins used in many different 3D printers, as well as ...