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Low temperature sintering Cu nanoparticle (NP) paste is a promising solution to fulfill the harsh requirements of Wide band gap (WBG) power device packaging. However, spontaneous oxidation of the Cu ...
Drying of stencil-, screen-, or dispense-printed paste is a crucial, yet taken-for-granted, presintering step for sinterable-silver (SS) interconnect processing and ultimately its reliability. If the ...
The memorandum of understanding records the intention of the parties to "collaborate for studying, planning and development of activities for technical uranium concentrates processing, with the ...
Discover Mitsui Mining & Smelting's innovative bonding sheet patent, enhancing electrical connectivity in electronics with high-performance copper foil and sinterable films.
The patterning of silver nanowires (AgNWs) is subject to critical challenges, which have seriously limited their practical applications. This work describes a simple and efficient method combining ...
Emery Oleochemicals has supplied its binder system to the powder injection industry over thirty years. This binder system is said to be applicable to almost all sinterable materials to create entirely ...
3DGence announced the “ELEMENT” series of metal 3D printers to accompany their INDUSTRY thermoplastic series. The Polish company has produced industrial-level thermoplastic 3D printers for several ...
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