JMMP publishes top research in the nanomechanics and micromechanics of materials and with regard to molecular physics.

A micromechanics model and an associated computational scheme are proposed to study interface delamination in plastic integrated circuit (IC) packages induced by thermal loading and vapor pressure.

The flip-chip assembly, which is composed of three main components, i.e. chip with C4 interconnects, underfill and substrate, undergoes thermal loading during the curing process and its operational ...

In this paper, the bi-axial stretching effects on the electrical conductivity of carbon nanotube (CNT)-polymer composites are studied by a mixed micromechanics model with the consideration of the ...

Does anyone care or dream about a tourbillon watch anymore? ✓ Read Lex's analysis of the state of tourbillons in the watch ...

In other words, its name means “undo the war.” But the protest goes further: Mr. Winter built it with metal from a Russian ...

Introducing some more watch madness ✓ The Behrens × Konstantin Chaykin “Ace of Hearts” in different materials and colorways ✓ ...

The delivery of molecules, such as DNA, RNA, peptides, and certain hydrophilic drugs, across the epidermal barrier poses a significant obstacle. Microneedle technology has emerged as a prominent area ...

Exposure of cells to electric fields is used in applications as diverse as deep brain stimulation to treat the symptoms of Parkinson’s disease, tumor-treating fields to delay the progression of ...

Micromechanics of engineering systems. Contact mechanics and high-speed impacts. Tribology of interacting surfaces including gears, bearings and oil drilling applications. Investigation of thermal ...