The through-Silicon-Vias (TSV) is a key component of three dimensional electronic packaging, knowing its stresses is very important for its reliability evaluation. In this paper, we evaluated the ...

We study the electric-field-induced birefringence and orientational order in the isotropic phase of aqueous suspensions of exfoliated natural beidellite clay particles, thin (L = 0.65 nm) flat charged ...

We report a method to create anisotropic double-network (DN) hydrogels, through the controlled orientation of a physical sacrificial network. A cross-linked polyacrylamide hydrogel is synthesized from ...

Recycled plastics are key for circular economies, yet their widespread adoption is limited by unpredictable mechanical performance. This variability discourages their adoption, particularly in ...