Removal of polyimide layer after decapsulation of IC package is essential for many of the failure analysis techniques. An alternative method for polyimide removal is described in this paper. The ...

Failure analysis of the semiconductor device has the demand that the inspection should be performed without mold decapsulation. Conventional PEM(Photo Emission Microscope) and IR-OBIRCH(InfraRed ...

Honest Components (HCI), a supplier of obsolete and hard-to-find electronic board-level components, has launched a new online database housing over 3 000 legacy and discontinued parts, all searchable ...

Jeremy Courtney, senior director, CTO Office at Lawo, discusses how R&D has always been a balancing act between meeting ...