AI热潮面临着功耗问题，而这不仅仅是电力问题。随着生成式模型规模不断扩大，数据中心竞相跟上发展步伐，讨论大多集中在计算能力上：更多GPU、集群和芯片。但深入研究后会发现，真正的制约因素并非机器思考速度，而是基础设施层面的其他问题。 为大语言模型提供超大规模高维数据需要能够以最小损耗和功耗传输每秒TB级数据的基础设施。作为互联网时代默认连接方式的铜质interconnect正开始在这种负载下出现问题 ...

The X-Sense XS01-M Interconnected Smart Smoke Alarm is one of the most affordable networked smoke detection systems in its ...

An new technical paper titled “Fast and Accurate Jitter Modeling for Statistical BER Analysis for Chiplet Interconnect and ...

首先，INTERconNEcT-EDs作为首个整合IPT原则的数字化GSH方案，通过靶向人际困难这一跨诊断因素，实现了对多种EDs亚型的广谱覆盖。 其次，研究证实了"任务共享"策略在EDs领域的可行性——经过培训的非专业人员可有效提供支持，这对资源匮乏地区尤为重要。

Explore key design challenges and solutions when selecting connectors for next-gen robotic systems. White Paper by LEMO From ...

Israeli fiber-to-chip interconnect developer Teramount raised $50 million in a funding round led by Koch Disruptive ...

The Universal Chiplet Interconnect Express (UCIe) is an open chiplet standard for implementing a high-bandwidth, low-latency ...

Optical interconnect startup Teramount has raised $50 million in a Series A funding round led by new investor Koch Disruptive ...

As demand for computing power accelerates alongside the rise of large-scale and multimodal AI models, China is ramping up ...

Quantum computers, devices that can perform computations relying on the principles of quantum mechanics, are expected to ...

A modular approach to SoC interconnect slashes power consumption with unit-level clock gating. While power management has only grown in importance for system-on-chip (SoC) developers, the one crucial ...

Figure 1: Arteris FlexNoC interconnect IP provides hundreds of features to optimize users' SoC designs. The goal of many of these features is to improve the power, performance and area (PPA) of the ...